Monday, March 21, 2022

3rd Gen AMD EPYC Processors Deliver Outstanding Leadership Performance

AMD announced the general availability of the world’s first data center CPU using 3D die stacking, the 3rd Gen AMD EPYC™ processors with AMD 3D V-Cache™ technology, formerly codenamed “Milan-X.” Built on the “Zen 3” core architecture, these processors expand the 3rd Gen EPYC CPU family and can deliver up to 66 percent performance uplift across a variety of targeted technical computing workloads versus comparable, non-stacked 3rd Gen AMD EPYC processors.