3rd Gen AMD EPYC Processors Deliver Outstanding Leadership Performance

AMD announced the general availability of the world’s first data center CPU using 3D die stacking, the 3rd Gen AMD EPYC™ processors with AMD 3D V-Cache™ technology, formerly codenamed “Milan-X.” Built on the “Zen 3” core architecture, these processors expand the 3rd Gen EPYC CPU family and can deliver up to 66 percent performance uplift across a variety of targeted technical computing workloads versus comparable, non-stacked 3rd Gen AMD EPYC processors.