Intel’s Chip with Award-Winning Foveros 3D Tech

The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with a more-traditional pancake-like design. Intel’s Foveros advanced packaging technology allows Intel to “mix and match” technology IP blocks with various memory and I/O elements – all in a small physical package for significantly reduced board size. The first product designed this way is “Lakefield,” the Intel® Core™ processor with Intel hybrid technology.