Tiny Intel EMIB Helps Chips ‘Talk’ with Each Other

Most chips in today’s smartphones, computers and servers are comprised of multiple smaller chips invisibly sealed inside one rectangular package. How do these multiple chips — often including CPU, graphics, memory, IO and more — communicate? An Intel innovation called EMIB (embedded multi-die interconnect bridge) is a complex multi-layered sliver of silicon no bigger than a grain of rice. It lets chips fling enormous quantities of data back and forth among adjoining chips at blinding speeds: several gigabytes per second.