Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox

This week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel’s advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology. When combined with Intel’s world-class process technologies, new packaging capabilities will unlock customer innovations and deliver the computing systems of tomorrow.