Is AMD Vega's package construction a problem? My colleagues at Tom's Hardware are on the case.
There's been some confusion floating around about the GPU package construction of AMD's new Vega, in particular surrounding the use of molding and its impact on package height and how this will affect third-party graphics card manufacturers, both in terms of cost and timing. We've talked to several sources, examined various packaging, and conducted a couple of quick experiments in order to provide a clearer picture of these issues.
