Holy cow, this sure looks mighty promising, doesn't it?
Western Digital on Tuesday formally announced its fourth-generation 3D NAND memory, developed as part of the Western Digital/Toshiba joint venture. The fourth-generation BiCS NAND flash chips from Western Digital feature 96 layers and will include several capacity points and will use TLC and QLC architectures. The company expects to start volume production of BiCS4 chips in 2018.
