Both Intel and AMD are showing off some specs of their upcoming products at the International Solid State Circuits Conference in San Francisco.
Intel gave the most detailed look at its lower cost alternative to 2.5D packaging in a paper on its Stratix X FPGA at the International Solid State Circuits Conference (ISSCC) here. In the same session, AMD showed its Zen x86 processor sports a 10 percent smaller die than Intel’s latest 14nm CPUs. In a separate paper, AMD said its upcoming Zen x86 core fits into a 10 percent smaller die area than Intel’s currently shipping second-generation 14nm processor.
